10.1 Solder and Bond Surfaces | General

The purpose of the surface finish is to protect the copper against oxidation. It ensures the solderability of your PCB and increases the mechanical load capacity of plug or sliding contacts.
The specified solderability assumes compliance with the following storage conditions:
  • Storage temperature: max. 30 °C (as recommended by ZVEI)
  • Relative humidity: max. 70 % (as recommended by ZVEI)
ZVEI Recommendation

Comparison of Surface Finishes – Design to Cost

Surface finishElectroless Nickel
Immersion gold		Immersion TinElectroplated Nickel/GoldHAL
(lead-free/leaded)		OSP
(Organic Solderability Preservative)
Application
  • Soldering
  • Press-fit technology
  • Fine pitch
  • BGAs
  • Al wire bonding
  • Conductive bonding
  • Soldering
  • Press-fit technology
  • Fine pitch
  • BGAs
  • Sliding contacts
  • Plug-in contacts
  • Soldering
  • Press-fit technology
  • Soldering
  • Press-fit technology
  • Fine pitch
  • BGAs
Processing warranty
in months		12912126
Plating thicknesses [µm]Ni 3 - 7
Au 0.05 - 0.12		0.8 - 1.4Ni 3 - 8
Au 0.8 - 3		Surface: 1 - 30
Hole < 3.0 mm: 1 - 50
Hole ≥ 3.0 mm: 1 - 70		0.2 - 0.6
Costs€€€€€€€€€€€€€

Blog

Solder surface or printed circuit board finish, Part 1: Function and properties

Frequently asked questions

What is the best PCB surface for lead-free soldering?
There is no such thing as a “best” surface; all surfaces have their advantages and disadvantages. The choice of surface depends on many factors. If you cannot find what you are looking for in our Digital Design Compass, please contact our technical support team.

Keywords

  • Surface finish comparison
  • Lead-free soldering
  • Shelf life
  • Design to Cost
  • Surface finishes
  • Storage and assembly
Next entry:
10.2 Electroless Nickel Immersion Gold
Go to the next entry