2.4 Thermal Management
Iceberg PCB
HSMtec® Thermal Management
Copper IMS PCB
Features & Advantages
- High currents and heat spread in the PCB
- High currents and control electronics in one board
- Use of standard materials/technologies
- Further processing using the standard assembly process
- Lower costs thanks to the elimination of additional connection technology and manual work steps
Features & Advantages
- Targeted heat conduction of the heat loss from power components
- Creation of an individual concept based on your requirements
- Support with the processes of designing, dimensioning, and selecting the concept for your PCB
- Thermal simulations, measurements and analyses
- Layout can be implemented using the standard process
Features & Advantages
- LED/power applications with high power dissipation densities
- High cycle stability & long service life even for large component packages
- Also ideal for components with a live heat sink connection
- Thermal simulations, measurements and analyses
- Fully electrically insulated copper base, with the result that no insulating TIM (thermal interface material) is required
Frequently asked questions
Does KSG simulate thermal management, e.g., using FEM simulators? Which tool does KSG use for this?
For simulations carried out in advance, KSG uses TRM from ADAM Research (https://www.adam-research.de/en/). Further information about thermal analyses can be found in Section 17.6.
Keywords
- Heat dissipation
- Heat spreading
- Thermal conduction
- FEM simulation
- Thermal management