3.3.1 High-Frequency PCB | General
General
Back to top
At higher transmission frequencies, standard FR4 is no longer sufficient to ensure interference-free signal transmission. For this reason, optimized materials are used at frequencies of up to 80 GHz. The product can be designed as a double-sided or multilayer PCB, and it is also possible to combine the materials used with FR4.
Features & Advantages
- Signal integrity ensured for electronic interconnect devices
- Various different HF base materials based on epoxy resin and glass or PTFE and ceramics 4.3 Base Materials | High-Frequency PCB
- Full and hybrid stackups
- Support provided right from the design phase
- Narrow tolerances ensured in the key processes of multilayer pressing and creation of the conductive pattern structuring
Frequently asked questions
What specific data is required for CAM preparation prior to backdrilling?
To enable CAM preparation for PCBs that involve backdrilling, a separate drill file is advisable. You can either use an individual drill file or you can use several if there are differences in the depth or side (top or bottom side) of the backdrilling holes. For optimum processing, we also recommend providing a detailed drawing as well. This should clearly identify the positions, sizes, and backdrilling depths of the backdrilling holes. Following this advice will make the CAM preparation process easier while minimizing the risk of errors.
Keywords
- RF PCBs
- Skin effect
- Dielectric constant (Dk)
- Dissipation factor (Df)
- Copper roughness
- Signal reflection
- High frequency
- Material selection