3.10.1 Embedded Technology
In this article:
General
Back to top
No space on the outer layers? Why not use an additional placement level inside the PCB?
With its embedding technologies, KSG offers the perfect solution for integrating active and passive
electronic components – down to a minimum size of 01005 and up to a maximum component height of 2.5 mm.
With its embedding technologies, KSG offers the perfect solution for integrating active and passive
electronic components – down to a minimum size of 01005 and up to a maximum component height of 2.5 mm.
Features & Advantages
- Production of application-specific systems (system-in-package, SiP)
- Maximum miniaturization can be achieved
- Elimination of board-to-board solutions
- Enclosure elimination/protection against accidental contact
- Optimized heat and power distribution
- Improved EMC
- Shorter signal paths
- Reverse engineering is difficult/protection against counterfeiting
- Protection against extreme weather influences
- Protection against the effects of vibration, impact, and pressure
As well as integrating resistors, capacitors, and inductors into the interior of the PCB as discrete components, KSG can also integrate a wide range of active components such as sensors or microcontrollers. Its technological know-how in this area goes back many years. With the aid of conventional stackup and connection technologies – such as soldering or conductive bonding – these components are bonded on an inner layer, pressed to form a multilayer, and then undergo final processing using the standard production process. Almost the entire net area of a production panel measuring 573 x 426 mm can be utilized.
Keywords
- Component embedding
- Embedded components
- Cavities
- Pad bonding
- Laser vias
- Multidimensional PCBs
- Miniaturization
- Laser processing