3.4.1 Heavy Copper PCB

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With a heavy copper PCB, copper layer thicknesses of up to 400 µm can be achieved using conventional etching technology. As a result, large copper cross-sectional areas for electricity or heat can be realized efficiently while selectively reducing power dissipation. The product is usually designed as a multilayer or double-sided PCB. With this PCB technology, it is also possible to combine fine layout structures on the outer layers with thick copper plating in the inner layers.

Features & Advantages

  • High currents and heat spread in the PCB
  • Targeted partial cross-section enlargement for high-current paths
  • Minimization of the space required for high-current traces
  • Power and control electronics on one board
  • Can be processed using the standard process and standard materials
Current-carrying capacity - you can use our free tool Online High-current calculator to calculate the conductor cross-section or design width required for the respective high-current conductor for several PCB technologies. All you have to do is enter a few details. In addition, our Technical Support Team will be happy to assist you with the processes of dimensioning your high-current conductors and selecting the most suitable PCB technology.

Frequently asked questions

Does KSG simulate thermal management, e.g., using FEM simulators? Which tool does KSG use for this?

For simulations carried out in advance, KSG uses TRM from ADAM Research (https://www.adam-research.de/en/). Further information about thermal analyses can be found in Section 17.6.

In the case of a heavy-copper PCB, can the heavy copper be applied just to certain areas of the printed circuit board?

Unfortunately, this is not possible with heavy-copper PCBs. Differences in copper thickness can only be achieved in relation to pairs of layers. A requirement such as this can be accommodated by an “Iceberg PCB” (Section 3.5) or an HSMtec® PCB (Section 3.6) with partially integrated heavy-copper elements. These technologies allow copper of different thicknesses to be implemented within a single layer, meaning that high-current (power) elements and fine conductors can be combined on one PCB while physically separating them.

Can the “microvia, internal via, and through via” types be used in combination on a heavy-copper PCB?

When the inner layer copper is very thick, the spacing is greater due to the number of prepregs required, making microvias completely unsuitable. However, the combined use of small blind vias, internal vias, and through vias can be arranged in consultation with our technical support teams and project engineers (depending on the general conditions).

Keywords

  • Heavy copper
  • High current
  • Design to Cost
  • Copper thickness
  • Material selection
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3.4.2 Heavy Copper | Design Rules
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