3.6.2 HSMtec® PCB | High-Current
In this article:
- 3.6.2 HSMtec® PCB | High-Current
- General
- Range of Configuration Options
- Layer stackup - Minimum Construction- and Design Rules
- Overhead view - Minimum Construction- and Design Rules
- Typical Layer Stackups
- Contact/Connection Technologies
- CAD Data Creation
- Cost Comparison of HSMtec vs. other PCB Technologies
- 3.6.2 PCB | Current-Carrying Capacity
- Influencing Factor – Layer Stackup
- Influencing Factor – Permissible Heating of the Conductors (ΔT)
- Influencing Factor – Single Conductor/Bundle Conductor
- Influencing Factor – Ambient Temperature
- Current-Carrying Capacity of Cross-Section Reductions