17.3 Layer Stackup Calculation

Whether you’re trying to decide on the number of layers, the material or the minimum distances – choosing the right layer stackup for your PCB opens up huge potential for optimization with regard to producibility, service life and costs. And this is why it’s always worth carrying out calculations based on wide-ranging practical experience. In concrete terms: You tell us the thermal and electrical properties; we work out the optimal layer architecture, making sure that it’s technically feasible.

How exactly does this work? By using our proprietary KSG calculation tool. This tool allows us to combine real-life practical production findings with the knowledge of our PCB experts, allowing you to benefit from customized optimizations and a resource-efficient use of materials in your own specific layer stackup. One thing always stays the same – for cost-optimized production, we recommend having homogeneous and symmetrical copper distribution and a symmetrical layer stackup.

Example Layer Stackup Calculation

What You Can Expect

• Compliance with the required minimum distances between the individual layers
• Optimum resin filling of the conductor structures
• Dielectric distances for impedance structures
• Compliance with the required total thickness
• Optimization with regard to bow and twist