12.5 Advanced Technology | Button-Plating

Features & Benefits

  • Metallization of drill holes without additional copper build-up in the layout
  • More precise structuring possible, as the base copper is very thin (5...10µm)
  • Avoids excessive base copper thicknesses during multiple metallization of drill holes



Disadvantages

  • Higher costs compared to standard technology due to additional photo printing and electroplating processes
  • Layout may exclude the use of button plating (residual ring width too small)

Keywords

  • Button plating
  • Pads-only plating
Next entry:
13.1 Impedance | General
Go to the next entry