12.2 Advanced Technology | Edge Metallization
To improve the EMC of a PCB, establish electrical contact with the assembly enclosure, or meet higher cleanliness requirements, the front sides of the board outline can be metallized.
A straightforward way of improving EMC involves nothing more than including a narrow ring of plated holes close to the edge of the board outline. However, if the EMC requirements are high, nothing can beat “edge metallization”, as shown in the image on the right. To a certain extent, "edge metallization" can also be used for profitable heat management, which is another advantage of this technology.
In order for this to be successful, certain design rules must once again be observed. For example, the PCB must be connected to the sub-panel frame by a minimum number of retaining webs. These retaining webs briefly interrupt the edge metallization.
If required, our Technical Support Team will be happy to assist you with the design.
A straightforward way of improving EMC involves nothing more than including a narrow ring of plated holes close to the edge of the board outline. However, if the EMC requirements are high, nothing can beat “edge metallization”, as shown in the image on the right. To a certain extent, "edge metallization" can also be used for profitable heat management, which is another advantage of this technology.
In order for this to be successful, certain design rules must once again be observed. For example, the PCB must be connected to the sub-panel frame by a minimum number of retaining webs. These retaining webs briefly interrupt the edge metallization.
If required, our Technical Support Team will be happy to assist you with the design.
Keywords
- Edge plating
- Castellated holes
- Half-cut plated holes