10.7 Special Surfaces

Surface - ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

With the ENEPIG (electroless nickel electroless palladium immersion gold) PCB surface finish, the palladium is reductively deposited as an intermediate layer. It is the ideal surface finish for gold and aluminum wire bonding.
FeatureDescription / Value
Application
  • Au wire bonding
  • Al wire bonding
  • Soldering
Properties
  • RoHS compliant
Plating thickness Ni [µm]4 - 7
Plating thickness Pd [µm]0.05 – 0.25
Plating thickness Au [µm]0.03 - 0.08
Processing warranty in months
(at a max. storage temperature of 30 °C and max. relative humidity of 70 %)		12

Surface - Electroless Nickel/Reductive Gold

FeatureDescription / Value
Application
  • Au wire bonding
Properties
  • RoHS compliant
Plating thickness Ni [µm]3 - 8
Plating thickness Au [µm]0.4 - 0.8
Processing warranty in months
(at a max. storage temperature of 30 °C and max. relative humidity of 70 %)		12

Surface - EPIG (Electroless Palladium Immersion Gold)

The EPIG (electroless palladium immersion gold) PCB surface finish is suitable for HF applications because it is nickel-free.
FeatureDescription / Value
Application
  • Au wire bonding
  • Al wire bonding
  • Soldering
Properties
  • RoHS compliant
Plating thickness Pd [µm]0.1 – 0.2
Plating thickness Au [µm]0.1 – 0.2
Processing warranty in months
(at a max. storage temperature of 30 °C and max. relative humidity of 70 %)		12

Surface - DIG (Direct Immersion Gold)

The DIG (direct immersion gold) PCB surface finish is suitable for HF applications because it is nickel-free.
Feature Description / Value
Application
  • Au wire bonding
  • Soldering
Properties
  • RoHS compliant
Plating thickness Au [µm] 0.2 - 0.3
Processing warranty in months
(at a max. storage temperature of 30 °C and max. relative humidity of 70 %)		 3 - 6
(depends on application)

Surface - Immersion Silver

FeatureDescription / Value
Application
  • Soldering
  • Press-fit technology
  • Fine pitch
  • BGAs
Properties
  • Flat soldering surface
  • RoHS compliant
Plating thickness [µm]0.15 - 0.3
Processing warranty in months
(at a max. storage temperature of 30 °C and max. relative humidity of 70 %)		6

Keywords

  • Electroless nickel electroless palladium immersion gold (ENEPIG)
  • Electroless palladium immersion gold (EPIG)
  • Direct immersion gold (DIG)
  • Immersion silver
  • Autocatalytic gold
  • Surface finishes
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11.1 Sealing Technologies | General
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