10.2 Surface | Electroless Nickel Immersion Gold (ENIG)

FeatureDescription / Value
Application
  • Soldering
  • Press-fit technology
  • Fine pitch
  • BGAs
  • Al wire bonding
  • Conductive bonding
Properties
  • Flat soldering surface
  • RoHS compliant
Plating thickness Ni [µm]3 - 7
Plating thickness Au [µm]0.05 - 0.12
Processing warranty in months
(at a max. storage temperature of 30 °C and max. relative humidity of 70 %)		12

Keywords

  • Electroless nickel immersion gold (ENIG)
  • Surface finishes
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10.3 Immersion Tin
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