3.7 Copper IMS PCB

Insulated metal substrate PCBs/metal core PCBs with a copper base offer maximum thermal performance for simple electrical circuits in conjunction with optimum reliability.

Features & Advantages

  • Suitable for LED/power applications with high power dissipation densities
  • High cycle stability & long service life even with large component packages
  • Also ideal for components with a live heat sink connection
  • Fully electrically insulated copper base, with the result that an insulating TIM (Thermal Interface Material) might not be required

Capabilities

Feature
Standard
Design to Cost
Advanced
Learn
more
Carrier materialCopper---
Material typeThermal Clad series (Bergquist)---
Thermally conductive prepreg thickness [µm]76; 152
For further information, see Dielectric table		---
Cu thickness of end copper outer layer [µm]35; 70; 105; 210---
Max. Number of layers1---
Surfaces finishingElectroless nickel immersion gold (ENIG); Chemical tin
OSP; Electroplated nickel/gold; Gold wire bondable surfaces		---
Usable production area/
Format [mm]		573 x 426---

Dielectric

DielectricUL approval
Base material		Layer
thickness [µm]		Dielectric strength (*)
[kV]		Thermal conductivity (**)
[W/mK] 		Max. Operating temperature
[°C]
Thermal Clad HT
Granted
76
152		6.0
11.0		2.2140
Thermal Clad MPGranted768.51.3130
Advanced
Thermal Clad HPL
Granted385.03.0140

** Test method: ASTM D149
** Test method: Extended ASTM 5470

Download Datasheet/Selection guide

Keywords

  • Insulated metal substrate (IMS)
  • Copper core
  • Thermal management
  • Dielectric strength
  • LED lighting
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