KSG Design Compass Design Compass
    • 1 General
      • 1.1 Certifications
      • 1.2 Scope of Data/Data Formats
    • 2 Applications & Solutions
      • 2.1 Multidimensional & Space-Saving
      • 2.2 High-Frequency & Radar Applications
      • 2.3 High-Current Solutions
      • 2.4 Thermal Management
      • 2.5 LED Applications
    • 3 PCB Technologies
      • 3.1 HDI/SBU PCB
        • 3.1.1 HDI | General
        • 3.1.2 HDI | Design Rules 1-x-1 Stackup
        • 3.1.3 HDI | Design Rules 2-x-2 Stackup
        • 3.1.4 HDI | Design Rules 3-x-3 Stackup
      • 3.2 Multilayer PCB
        • 3.2.1 Multilayer | General
        • 3.2.2 Multilayer | Design Rules
        • 3.2.3 Multilayer | Standard Layer Stackups
      • 3.3 High-Frequency PCB
        • 3.3.1 High-Frequency | General
        • 3.3.2 High-Frequency | Design Rules
      • 3.4 Heavy Copper PCB
        • 3.4.1 Heavy Copper | General
        • 3.4.2 Heavy Copper | Design Rules
        • 3.4.3 Heavy Copper | Layer Stackups
      • 3.5 Iceberg PCB
        • 3.5.1 Iceberg | General
        • 3.5.2 Iceberg | Design Rules
      • 3.6 HSMtec® PCB
        • 3.6.1 HSMtec® | General
        • 3.6.2 HSMtec® | High-Current
        • 3.6.3 HSMtec® | Thermal Management + High-Current
        • 3.6.4 HSMtec® | 3D
      • 3.7 Copper IMS PCB
      • 3.8 Rigid-Flex PCB
        • 3.8.1 Rigid-Flex | General
        • 3.8.2 Rigid-Flex | Design Rules One Flex Layer Asymm.
        • 3.8.3 Rigid-Flex | Design Rules Two Flex Layers Asymm.
        • 3.8.4 Rigid-Flex | Design Rules Two Flex Layers Symm.
        • 3.8.5 Rigid-Flex | Design Rules Four Flex Layers Asymm.
        • 3.8.6 Rigid-Flex | Design Rules Four Flex Layers Symm.
        • 3.8.7 Rigid-Flex | Design Rules 2x Two Flex Layers Symm.
        • 3.8.8 Rigid-Flex | Further Stackups
        • 3.8.9 ZIF – Zero Insertion Force
        • 3.8.10 Rigid-Flex | Edge Sealing
        • 3.8.11 Rigid-Flex | Processing Application Recommendations
      • 3.9 Semi-Flex PCB
        • 3.9.1 Semi-Flex | General
        • 3.9.2 Semi-Flex | Design Rules One Flex Layer Asymm.
        • 3.9.3 Semi-Flex | Design Rules Two Flex Layers Asymm.
        • 3.9.4 Semi-Flex2 | Design Rules One Flex Layer Asymm.
        • 3.9.5 Semi-Flex | Application Recommendations
      • 3.10 Embedded Technology
        • 3.10.1 Embedded | General
        • 3.10.2 Embedded | Design Rules
      • 3.11 Double-Sided PCB
    • 4 Base Materials
      • 4.1 Base Materials | General
      • 4.2 Base Materials | Standard
      • 4.3 Base Materials | High-Frequency
      • 4.4 Base Materials | Rigid-Flex Print Circuit Board – up to Two Flex Layers
      • 4.5 Base Materials | Rigid-Flex Print Circuit Board – Four Flex Layers
      • 4.6 Base Materials | Semi-Flex
      • 4.7 UL-Certifications
        • 4.7.1 UL | Rigid PCB
        • 4.7.2 UL | Rigid-Flex PCB
    • 5 Sub-Panel Design/Panel Formats
      • 5.1 Sub-Panel/Production Formats
      • 5.2 Milled Sub-Panel
      • 5.3 Scored Sub-Panel
      • 5.4 Combination Scored-Milled Sub-Panel
      • 5.5 Example Sub-Panel/Material Utilization
    • 6 Markings
      • 6.1 Markings | General
      • 6.2 Markings | Logo
      • 6.3 Markings | UL
      • 6.4 Markings | Date Code
      • 6.5 Markings | Other
    • 7 Mechanical and Laser Processes
      • 7.1 Mechanics | General
      • 7.2 Drilling
      • 7.3 Press-Fit Technology
      • 7.4 Milling
      • 7.5 Scoring
      • 7.6 Beveling
      • 7.7 Countersinking/Depth Milling
      • 7.8 Laser Cutting
    • 8 Rules Holes/Conductive Pattern
      • 8.1 Through Hole
      • 8.2 Blind Via
      • 8.3 Microvia
      • 8.4 Buried Via
      • 8.5 Copper Plating Thicknesses in Holes
      • 8.6 Design Rules – Outer Layers/Metallized Layers
      • 8.7 Design Rules – Inner Layers
      • 8.8 Annular Ring/Tear Drops
      • 8.9 Blind Pad (Non-Functional Pad)
    • 9 Masks/Additional Printing
      • 9.1 Solder Mask
      • 9.2 Additional Printing | Identification Printing
      • 9.3 Additional Printing | Peelable Mask
      • 9.4 Additional Printing | Carbon Printing
      • 9.5 Additional Printing | Via Sealing per IPC-4761 Type IIIa
      • 9.6 Additional Printing | Heatsink paste
    • 10 Solder and Bond Surfaces
      • 10.1 Surfaces | General
      • 10.2 Electroless Nickel Immersion Gold
      • 10.3 Immersion Tin
      • 10.4 Electroplated Nickel/Gold
      • 10.5 HAL (Lead-Free/Leaded)
      • 10.6 OSP
      • 10.7 Special Surfaces
    • 11 Via Sealing Technologies
      • 11.1 Sealing Technologies | General
      • 11.2 Single-Sided Plugged Via per IPC-4761 Type IIIa
      • 11.3 Microvia (MV) Copper Filling
      • 11.4 Filled and Capped per IPC-4761 Type VII
    • 12 Advanced Technologies
      • 12.1 Backdrilling
      • 12.2 Edge Metallization
      • 12.3 Partially Electroplated Nickel/Gold
      • 12.4 PCB final thickness > 3,20 mm
      • 12.5 Button-Plating
    • 13 Impedance
      • 13.1 Impedance | General
      • 13.2 Impedance | Typical Structures
      • 13.3 Impedance | Measurement
      • 13.4 Impedance | Calculation Examples
      • 13.5 Impedance | Data to Be Supplied
    • 14 Testing Procedures/Quality Control
      • 14.1 Electrical Test
      • 14.2 Quality Control
    • 15 Packaging/Processing
      • 15.1 Packaging Variants
      • 15.2 Processing Recommendations
    • 16 Design Solutions/Recommendations
      • 16.1 Design Solutions | SMD Components
      • 16.2 Design Solutions | BGA
      • 16.3 Design Solutions | HSMtec®
      • 16.4 Design Solutions | Solder Mask
      • 16.5 Further Design Recommendations
    • 17 Services/Useful Tools
      • 17.1 Support for Optimal Sub-Panel Design
      • 17.2 Impedance Calculation
      • 17.3 Layer Stackup Calculation
      • 17.4 Design and Layout Check
      • 17.5 Calculation of Current-Carrying Capacity
      • 17.6 Thermal Analyses
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8.1 Design Rules | Through Hole/Via

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  • 8.1 Design Rules | Through Hole/Via for Heavy Copper

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