1 General
- 1.1 Certifications
- 1.2 Scope of Data/Data Formats
2 Applications & Solutions
3 PCB Technologies
- 3.1 HDI/SBU PCB
- 3.2 Multilayer PCB
- 3.3 High-Frequency PCB
  - 3.3.1 High-Frequency | General
  - 3.3.2 High-Frequency | Design Rules
- 3.4 Heavy Copper PCB
- 3.5 Iceberg PCB
  - 3.5.1 Iceberg | General
  - 3.5.2 Iceberg | Design Rules
- 3.6 HSMtec® PCB
- 3.7 Copper IMS PCB
- 3.8 Rigid-Flex PCB
- 3.9 Semi-Flex PCB
- 3.10 Embedded Technology
  - 3.10.1 Embedded | General
  - 3.10.2 Embedded | Design Rules
- 3.11 Double-Sided PCB
4 Base Materials
5 Sub-Panel Design/Panel Formats
6 Markings
7 Mechanical and Laser Processes
8 Rules Holes/Conductive Pattern
9 Masks/Additional Printing
10 Solder and Bond Surfaces
11 Via Sealing Technologies
12 Advanced Technologies
13 Impedance
14 Testing Procedures/Quality Control
- 14.1 Electrical Test
- 14.2 Quality Control
15 Packaging/Processing
- 15.1 Packaging Variants
- 15.2 Processing Recommendations
16 Design Solutions/Recommendations
17 Services/Useful Tools

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3.6.4 HSMtec® 3D PCB

In this article:

3.6.4 HSMtec® 3D PCB
General
Range of Configuration Options
Layer stackup - Minimum Construction- and Design Rules
Top View - Minimum Construction- and Design Rules
CAD Data Creation
HSMtec® 3D PCB | Further Processing Application

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