15.2 Processing Recommendations
Solder and Bond Surfaces
As a basic principle, the defined and stipulated storage conditions and maximum storage times for solder and bond surfaces must be observed to ensure optimal further processing!
Learn more under Solder and Bond Surfaces | General.
Learn more under Solder and Bond Surfaces | General.
PCB Drying
Under certain circumstances and depending on the PCB technology, PCB drying may be advisable and strongly recommended. If this is the case, drying can be performed ZVEI recommendations “Drying of PCBs before soldering”.
On the topic of Moisture absorption of Base materials/PCBs Learn more
With rigid-flex PCBs, it is essential to carry out drying before the soldering process;
more about this can be found under Rigid-Flex PCB | Processing Recommendations.
On the topic of Moisture absorption of Base materials/PCBs Learn more
With rigid-flex PCBs, it is essential to carry out drying before the soldering process;
more about this can be found under Rigid-Flex PCB | Processing Recommendations.
Processing Recommendations for “Multidimensional PCB Technologies”
For a flex-rigid PCB, please refer to the bending application guidelines under Rigid-Flex PCB | Processing Recommendations.
For an HSMtec 3D PCB, please refer to the bending application guidelines under HSMtec 3D PCB | Further Processing Application.
For an HSMtec 3D PCB, please refer to the bending application guidelines under HSMtec 3D PCB | Further Processing Application.
Keywords
- Baking
- Storage conditions
- Multidimensional PCBs
- Surface finishes
- Storage and assembly